苯并环丁烯树脂具有低的介电常数（～2.6）、低的吸湿率、高的热稳定性和化学稳定性（玻璃化转变温度Tg＞350℃），以及高的薄膜平整度（一般＞95%），综合性能优异。 Usually used as the adhesive bonding material in adhesive wafer-level bonding technique,and also used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications. Usually used as the adhesive bonding material in adhesive wafer-level bonding technique,and also used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications.